A Deeper HAST Chamber for Large PCB Reliability Testing: Introducing the ESPEC EHS‑222M‑L

ESPEC has expanded its HAST line-up with a new deeper‑format chamber, the EHS‑222M‑L, and Unitemp is now bringing it to UK customers.

Reliability testing is evolving fast. Boards are getting larger, component density keeps climbing, and development cycles are under pressure from every direction. To keep pace, ESPEC has a new deeper‑format chamber, the EHS‑222M‑L, and Unitemp is now bringing it to UK customers.

If you’re working with AI semiconductors, data‑centre hardware, automotive electronics or any high‑density PCB assemblies, this new model is designed with your challenges in mind.

Highly Accelerated Stress Test (HAST) systems are all about compressing reliability timelines. By applying high temperature, high humidity and pressure simultaneously, they expose failure modes far earlier than conventional testing.

ESPEC developed the EHS‑222M‑L specifically to support:

larger multilayer PCBs and motherboards
higher specimen volumes
the need for statistically meaningful datasets in fewer cycles

The chamber’s internal depth has been increased which means you can run large boards, including 290 × 460 mm & 220 × 470 mm formats, or multiple jigs in a single test.

The number of available signal terminals has been expanded from the standard 36 pins (up to 60) to 120 pins at up to 1,000 V.

Every application is different, so ESPEC allows you to tailor:

jig design
terminal count
power‑up requirements
This draws directly on ESPEC’s long experience in jig engineering, component selection and structural design.

Technical specifications at a glance
Temperature range: +105.0 to +142.9°C
Humidity range: 75 to 100% rh
Pressure range:019 to 0.193 MPa (Gauge)
Internal dimensions: φ394 × D626 mm
External dimensions: W1000 × H1713 × D1200 mm
Built for the next wave of electronics
AI, autonomous driving and high‑density computing all demand rapid development cycles and uncompromising reliability. The EHS‑222M‑L gives engineers the chamber capacity, flexibility and throughput needed to keep pace with these sectors.