State-of-the-art SMT manufacturing with 8 lines, advanced inspection, and ISO Class 6 clean room facilities.

Optimise production schedules using AI to manage capacity, reduce bottlenecks and respond quickly to changing priorities

Turn manufacturing data into smarter decisions with AI scheduling, predictive insights and your AI operations assistant.

Connect ERP, manufacturing, warehouse and logistics systems into one real-time operational view

Digitise your shop floor with real-time production visibility, OEE tracking, quality control and connected work orders.

Connect inventory, warehousing, transport and deliveries to improve visibility, accuracy and end-to-end execution.

X Ray Inspection System

The FISCHERSCOPE X-RAY 4000 is specially designed for coating thickness measurement and material analysis during strip electroplating processes. This measurement system has already been installed over 300 times in electroplating plants of diverse sizes. Because of the fast mechanisms for moving the measurement head, readings can be taken at various points on the product to be measured. The instrument's modular design enables targeted selection of the optimal X-ray source and the ideal detector to meet your specific requirements.

At Active-PCB Solutions, we are committed to delivering the highest quality standards for Printed Circuit Boards (PCBs) by incorporating advanced inspection and testing methods. One of the most crucial steps in our quality assurance process is X-Ray Testing of PBCs. This powerful, non-destructive inspection method allows us to detect hidden defects in PCB

The main application of the instruments from the XAN® range is coating thickness measurement and analysis of gold and other precious-metal alloys. Products in this range stand out through their ease of use and advantageous price-performance ratio. In addition, detectors, apertures and filters can be adapted according to requirements, so that the optimal measurement instrument is available for every material composition.

Handheld, desktop, inline: the XAN®500 X-ray fluorescence instrument is Fischer’s most versatile yet. It can be used as a handheld device, as a fully enclosed desktop unit or integrated directly into production lines. Equipped with a tablet computer, the XAN500 also utilizes the time-proven WinFTM® software. Besides the classic coating thickness measurement functions, WinFTM also provides fundamental parameter analysis. This makes it possible to measure without prior calibration – that is, standard-free.

With motor-driven axes (optional) and measurement direction from top to bottom, the measurement instruments from the XDL® range enable automated serial tests. A variety of versions – differing in their X-ray source, filter, Aperture and detector – make it possible to select the X-ray device with the configuration that best suits your specific measurement task.

Measurement instruments from the XUL® series are the solution of choice wherever the need is to determine coating thicknesses quickly and very precisely in electroplating or electronics manufacturing. The X-ray fluorescence instruments measure from bottom to top, enabling easy positioning of samples on the measuring stage. All X-ray instruments in this range are equipped with the same detector. You can choose apertures, filters and X-ray tubes according to the individual measurement task.

The FLIR X8580-HS SLS is a high-speed, high definition longwave IR camera designed for scientists and engineers who need to capture detailed imagery of fast events, perform custom radiometric measurements, or detect points of failure in composites, solar cells, and electronics. This thermal imaging camera combines 1280 × 1024 resolution from the SLS detector with high-speed frame rates to offer shorter snapshot speeds and wider temperature bands for crisp stop motion imagery of high-speed events. With a four-position motorized filter wheel and support for FLIR motorized focus lenses, the X8580-HS SLS will provide high quality recordings, save time, and mitigate frustration in dynamic acquisition environments.