Inspection and Testing

Quality comes first at Mat-Tech. That is why we have invested in our 3D X-ray ‘ultra-high performance micro focus’ inspection system. With the 3D X-ray we can very quickly create 2D- and 3D images with a very high resolution. Thanks to X-rays the 3D X-ray can visualize connections, that are invisible for a microscope.

At Mat-tech, the 3D X-ray is mainly used for:

Detecting of bridges and short circuits
Detecting of cavities in the soldering
Detecting of positioning and alignment errors on the printed circuits boards (PCB)
Analysis of other soldering errors
Quality control
Density analysis
Product contamination
Measurements

In addition at Mat-Tech Development & Testing (DAT) we are able to perform the following tests:

- Visual and Cross-sectional Research
Visual Inspection
Optical Microscopy
Scanning Electron Microscopy (SEM) with
EDX (Energy Dispersive X-ray Spectroscopy)
X-ray Examination

- Process Investigation
Wettability/ Solderability Tests (Meniscography)
Mechanical Tests
Hardness Tests
Shear Strength Test
Tensile Strength Test
Notch Impact Test

- Environmental Tests
Thermal Cycling Tests (TCT)
Thermal Shock Tests (TST)
Temperature/Humidity Tests
High Temperature Storage Tests
Vibration Test
Corrosion Tests