Transcend's HSD460I half-slim SSD

Transcend's HSD460I half-slim SSD is built with 112 layers of 3D NAND flash and the SATA III 6Gb/s interface, delivering never-before-seen transfer speeds. Applied with the Corner Bond technology and anti-sulfur resistor, the HSD460I is fortified to withstand demanding industrial applications. Following JEDEC's MO-297 standard, the HSD460I is fully tested in-house and is able to operate in wide operating temperatures ranging from -40℃~85℃, ideal for read-heavy applications and space-limited mobile devices such as industrial control systems, medical equipment, mobile devices, and POS terminals.

Hardware Features
-Compliant with RoHS 2.0 standards
-Compliant with JEDEC MO-297
-Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
-Key components fortified by default with Corner Bond technology
-Anti-sulfur technology implemented to prevent sulfurization in the environment
-Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
-Promised operational reliability in a wide temperature range (from -40°C to 85°C)

Firmware Features
-Dynamic thermal throttling
-Built-in LDPC ECC (Error Correction Code) functionality
-Advanced Global Wear-Leveling and Block management for reliability
-Advanced Garbage Collection
-Static Data Refresh
-Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
-TRIM command for better performance
-NCQ command for better performance
-Full drive encryption with Advanced Encryption Standard (AES) (optional)
-Power-saving DevSleep (Device Sleep) mode (optional)