Inline Oxide Reduction with Openair-Plasma®

Inline oxide reduction with Openair-Plasma®
The innovative REDOX®-Tool is ideally suited for the treatment
of printed circuit boards, power modules and substrates with
tin or nickel solder balls. The tunnel concept enables for the
first time:
• flux-free bonding
• cleaning and reduction of metal oxides
• inline contact improvement in a variety of applications
such as: Pre-sintering, Die-Bonding, Wire bonding and
flux-free thermocompression bonding