RFA570 eXpress cure Adhesive film for core bonding applications

RFA570 is unique product which has been principally designed for use with RP570 and RP570 FR eXpress cure epoxy prepregs, as an adhesive for core bonding applications. The distinctive characteristics of this product enable it to be cured in a press in 4 minutes at 140°C, thereby speeding up the processing of honeycomb sandwich panels - with either nomex or aluminium honeycombs. The product will also cure in autoclave, with a typical curing cycle of 4 minutes once the tool temperature has stabilised at 140°C. It is fully compatible with our full range of epoxy prepreg systems.