
JADE CHEMICAL SL
About us
JADE CHEMICAL was founded in Madrid in 2023, specialising in the development, manufacturing, and marketing of fine chemicals. Our products are widely applied in industries such as rubber tires, insulation materials, aerospace composites, carbon fibre composites, electronic communications, optical materials, rubber and plastic modification, and pharmaceutical intermediates.
In Europe, we operate with an outstanding sales and service team supported by a dedicated warehouse, enabling us to deliver localised solutions for our customers. Along with consistently providing high-quality products, we are equally committed to offering integrated logistics and warehousing support, ensuring peace of mind throughout the supply chain.
The company’s origins trace back to China, where it was first established in 2013. Today, we maintain one advanced R&D centre and two modern production facilities in China, serving clients across a wide spectrum of industries worldwide. As a dynamic and fast-growing enterprise, we not only supply standard products but also collaborate closely with our partners to design customised solutions tailored to their specific requirements.
At JADE CHEMICAL, we are dedicated to creating long-term value for our customers, shareholders, and employees. Guided by a philosophy of excellence and continuous innovation, we strive to remain a trusted partner in the global fine chemicals industry.
Products

Functionized 2D Ti₃C₂ MXene
Ti₃C₂ is one of the most representative and significant members of the 2D MXene family, demonstrating exceptional potential in diverse fields such as energy storage, electromagnetic interference (EMI) shielding and absorption, and advanced electronic applications. Structurally, Ti₃C₂ consists of three key functional atomic sites: Ti, C, and surface termination layers, which collectively enable its unique physical and chemical properties. In our project, we have successfully synthesized functionalized Ti₃C₂ materials tailored for specific applications through precise atomic-level engineering, including doping, substitution, and vacancy modulation. These strategies not only expand the versatility of Ti₃C₂ but also allow us to systematically tune its electronic, optical, and structural characteristics to meet the requirements of different technologies. A major innovation of our work lies in bridging fundamental research with scalable practice. We have made substantial progress in the large-scale production of functionalized Ti₃C₂, addressing a key bottleneck in MXene commercialization. This advancement contributes significantly to both theoretical understanding and practical deployment in areas such as charge storage, superconductivity, EMI shielding and absorption, and optoelectronic transitions. Our results demonstrate that by combining advanced atomic engineering with scalable synthesis, Ti₃C₂-based materials can evolve from laboratory research into industrial solutions, paving the way for next-generation technologies in energy, electronics, and communications. Applications: 1. Energy Storage (Lithium-ion batteries, Sodium-ion batteries, Supercapacitors) 2.Electromagnetic Shielding & Absorbing Materials (EMI Shielding & Absorbers) 3.Electronics & Optoelectronic Devices (Sensors, Field-Effect Transistors, Photoelectric Conversion) 4.Superconductivity & Quantum Materials

N, N ’-4, 4’- diphenylmethane bismaleimide
N, N ’-4, 4’- diphenylmethane bismaleimide Abbreviated: BMI or BDM.(BMI-1000) CAS No. : 13676-54-5. Formula: C21H14N2O4 Molecular weight: 358.37 Usage: BMI level as manufacturing heat resistant structure material, H or F electrical insulating mat erials, a kind of ideal resin matrix are widely used in aviation, aerospace, electric power, electronics, c omputer,communication, automobile, railway, construction and other industries. 1. Motor insulation materials,The high temperature resistant dipping paint (solvent and non solvent), w ire coating, laminated board, knitting belt, mica tape, electronic copper clad, molded plastic, epoxy mo dified F ~ H class powder coating, casting pieces.. 2. Advanced composite materials, polymer matrix: aerospace, aeronautical structure materials, carbon fi ber high temperature resistant structure, high-grade printing circuit board and other functional material s, etc.). 3. Engineering plastics such as polypropylene PP, nylon, PBT, PA, ABS, APC, PVC, EPDM, PMMA materi al such as the enhancement of modifying agent (such as: glass fiber reinforced polypropylene to join < 1% of BMI, can make the mechanical strength and Martin heat resistant double effect), can also be us-ed in new type rubber vulcanizing agent, etc. 4. Wear resistant material, diamond wheel, heavy d uty grinding wheel, brake pads, high temperature resistant bearing binder, magnetic materials, etc

N,N’-m-phenylene bismaleimide
N,N’-m-phenylene bismaleimide Abbreviated: PDM or HVA - 2. (BMI-3000) CAS No. : 3006-93-7 Formula:C14H8N2O4 Molecular weight: 268 Usage: Also called PDM or HVA - 2, multi-functional rubber additives, can be used in the process of rubber processing as vulcanizing agent, also can make peroxide system helps the vulcanizing agent, can make antiscorching agent and tackifier, applies to general-purpose rubber, also applies to special r-ubber and rubber and system.Cooperate with sulfur in natural rubber, can prevent sulfide to return th-e original and improved heat resistance, reduce the heat generated, ageing resistance. Improve rubber and cord adhesion force and sulfide film. Used in truck tire shoulder gum, rubber cushion layer. It can solve the problem of oblique load tire shoulder empty.It can also be used for large size thick product-s of natural rubber,In chloroprene rubber, chlorosulfonated polyethylene rubber, styrene-butadiene rubb-er, nitrile rubber, isoprene rubber, butyl rubber ,brominated butyl rubber, acrylate rubber, silicone rubbe-r and rubber and rubber and other special rubber, as auxiliary vulcanizing agent, crosslinking performa-nce can be improved significantly, improve the heat resistance, is suitable for the high temperature flui-dization system. Reduce the compression permanent deformation is very obvious. It can reduce the do-sage of peroxide, can prevent the rubber scorch in the process, improve and rubber tire cord and m-etal bonding strength.

N, N '-(4-methyl-1,3-phenylene) bismaleimide
N, N '-(4-methyl-1,3-phenylene) bismaleimide Abbreviations: BMI-3000H CAS No: 6422-83-9 EINECS No: 229-175-3 Formula: C15H10N2O4。 Molecular weight: 282.25 Usage: As an important resin matrix, the product has excellent high temperature resistance, oxidation resistance and radiation resistance, widely used in aerospace, electric power, communication, automobile, railway, construction, computer and other industrial fields.

3,3-Dimethyl-5,5-diethyl-4,4-diphenylmethane Bismaleimide
3,3-Dimethyl-5,5-diethyl-4,4-diphenylmethane Bismaleimide Abbreviations: BMI-5100(BMI-70) CAS No: 105391-33-1 Formula: C27H26N2O4 Molecular weight:442.51 Usage: BMI-5100 as manufacturing heat resistant structure material, H or C electrical insulating materials, a kind of ideal resin matrix are widely used in aviation, aerospace, electric power, electronics, computer, communication, automobile, railway, construction and other industries. 1.Motor insulation materials, the high temperature resistant dipping paint, wire coating, laminated board, knitting belt, mica tape, electronic copper clad, molded plastic, casting pieces. 2.Advanced composite materials, polymer matrix: aerospace, aeronautical structure materials, carbon fiber high temperature resistant structure, high-grade printing circuit board and other functional materials, etc.

2.2 BIS(4-4-MALEIMIDEPHENOXY)PHENYL) PROPANE
Mainly used for copper-clad laminates.

ANILINE, 4-[2-(4-HYDROXYPHENYL)PROPAN-2-YL]PHENOL
BMl-2300 as manufacturing heat resistant structure matenial,H or C electrical insulating materials,a kindof ideal resin matrix are widely used in electric power,electronics,computer,communication and other industries. 1.Motor insulation materials,the high temperature resistant dipping paint,wire coating,laminated board, knitting belt,mica tape,electronic copper clad,molded plastic,casting pieces 2.Advanced composite materials, polymer matrix: aerospace, aeronautical structure materials, carbon fiber high temperature resistant structure,high-grade printing circuit board and other functional materials,etc

Ultrafine polyimide Resin powder (PI)
Usage: This product appearance for yellow superfine powder, mainly used as diamond wheel, high-speed heavy-duty resin grinding wheel and grinding resin grinding wheel bond strength, it has excellent heat resistance, abrasion resistance, molten liquidity is good, the abrasive has good wetting and bonding performance. Processing is convenient, good in usability, long-term use of the results showed that this product has been the preferred ideal binder, users. PI products as high temperature resistant polymer and resin of high performance composite matrix resin, are also increasingly widely used in aerospace, electrical/electronics, motorcycle, automobile, precision machinery and automatic office machinery, and other fields can be used in the preparation of high resistance, low temperature solid self-lubricating materials, precision machinery parts, all kinds of bearings, gaskets, sealing ring, radar equipment, molded products, paint, adhesives and electric insulation board, insulation tube, transformer insulation of wire coil, coil high-performance electrical insulation materials and other products.

N-Phenylmaleimide
N-Phenylmaleimide Abbreviations: N-PMI CAS No: 941-69-5 EINECS No: 213-382-0 Formula: C10H7NO2 Molecular weight:173.17 Usage: 1.Heat-resistant modifiers (ABS, PVC, PMMA) 2. Pharmaceutical intermediates; 3. Optical materials; 4. Antifouling paint.

N-Cyclohexylmaleimide
N-Cyclohexylmaleimide Abbreviations: CH-MI CAS No: 1631-25-0 EINECS No: 216-360-6 Formula: C10H13NO2 Molecular weight:179.22 Usage: 1.Heat-resistant modifiers (ABS, PVC, PMMA) 2. Pharmaceutical intermediates; 3. Optical materials; 4. Antifouling paint.

2, 2 '- Diallyl bisphenol A
2, 2 '- Diallyl bisphenol A Abbreviations: DABPA CAS No. : 1745-89-7 EINECS No. : 217-121-1. Formula: C21H24O2 Molecular weight: 308.42 Usage: 1. Mainly used for bismaleimide (BMI) modification, improve the operability and manufacturability of BMI resin. 2.Improve BMI resin toughness and heat resistance. (1) Electronic chemicals, high temperature resistant dipping paint of electrical insulating materials, copper clad laminates, laminate, moulded plastic. (2) The wear-resisting material, diamond wheel, brake pads, high temperature resistant bearing adhesives. (3) The aerospace structure materials. (4) Functional materials. 3. The rubber stabilizer. Add 1-3% DABPA in rubber, can greatly improve the degree of resistance to aging of rubber.

Allyl methylphenol
Allyl methylphenol CAS NO :3354-58-3 Formula: C10H12O molecular weight: 148 Usage: Used as BMI or epoxy modified or RTM process low viscosity resin reactive diluent.

2 - Allylphenol
2 - Allylphenol CAS No. : 1745-81-9. Formula C9H10O. Molecular weight: 134.18. Usage: Used as BMI or epoxy modified or RTM process low viscosity resin reactive diluent, and organic synthesis intermediates.
News

Jade Chemical at JEC Paris, 2026
Jade Chemical will participate in JEC Paris, 2026 on March 10-12. Hall 6, stand 6R14.

Jade Chemical at Sampe Conference 25 Amsterdam
Jade Chemical is one of the Sponsors of Sampe Conference 25 Amsterdam on October 6&7.

Jade Chemical at AE UK Birmingham
Jade Chemical will participate in Advanced Engineering, Birmingham on Oct 29&30, 2025. Stand X202

Jade Chemical at K 2025
Jade Chemical will participate in K 2025, Germany. Hall 7 Level 0 Stand SU-16.

Jade Chemical, membership of AEMAC, Spain
Jade Chemical is a member of AEMAC, Spain

Jade Chemical at MATCOMP 25
Jade Chemical is one of the Sponsors of MATCOMP 25, Barcelona, Spain