Alaris Linwave Chip and Wire Capability

Alaris Linwave’s advanced Chip and Wire capability provides customers with an advanced RF solution when a packaged device is not available or will not provide the required performance.

In the RF and Microwave design world, a significant portion of a module’s functionality is delivered by Monolithic Microwave Integrated Circuits (MMICs). These semiconductor devices can perform a wide array of functions, including microwave amplification, attenuation, mixing, oscillation, and high-speed switching. Traditionally fabricated using Gallium Arsenide (GaAs), and more recently Gallium Nitride (GaN), most MMICs are housed in plastic or ceramic packages, facilitating ease of handling, testing, and soldering onto PCBs during the assembly process.

However, in certain scenarios, particularly at higher frequencies, packaged components may be unsuitable or unavailable. In such cases, MMICs are supplied as bare die or in wafer form. These die often offer superior RF performance, such as improved gain flatness and linearity, compared to their packaged counterparts. In some instances, suppliers provide components exclusively in die form.

Processing MMICs in die or wafer form presents significantly greater complexity than working with packaged parts. Die are often extremely small (less than 1 mm in length), necessitating the use of microscopes for precise handling and placement on PCBs or carrier circuits. Their delicate nature requires specialized tools and expert handling. Moreover, the bonding pads along the edges of the die are exceptionally small (typically <0.1 mm), and attaching the bond wires—responsible for carrying power and signal—demands highly sophisticated equipment and the skill of experienced operators.

Typical Chip and Wire implementation showing MMIC die and bond wires

Alaris Linwave have the capability to handle all aspects of MMIC die processing. MMICs are received as individual die, or in wafer form which can then be sawn into individual dice.