Alaris Linwave System in Package (SiP) Capability

Alaris Linwave’s advanced System in Package capability (SiP) provides customers with complex RF solutions in small, robust, and easily handled packages. RF designs are implemented in a multi-chip module using various bare die from MMIC vendors plus passive surface mount components designed for wire bonding. The die are attached to the package ground paddle using conductive epoxy or eutectic attach methods. Interconnect between components is achieved by custom thin film alumina circuits and/or gold bond wires. Bond wires are also used to connect the system to the I/O, supply and control. The standard package available from Linwave is plastic QFN (Quad-Flat No-leads), the package size being optimized for the application. Future developments envisage custom ceramic packages for Space applications.

A number of standard or customer-defined solutions are available, including low noise amplifiers (LNA), limiters, limiter + LNA, zero-bias detectors, and switched filter banks. New designs, including beamforming elements for electronically steerable phased array antennas, are in development.

Alaris Linwave provides the full design, manufacture, and test cycle, from initial customer specification to final packaged part. The RF circuits are designed and simulated by an experienced design team using industry standard tools.

A Class 10000 clean room is available to implement the sophisticated manufacturing techniques required to handle the delicate die parts, including epoxy and eutectic die attach, semi-auto or manual bonding using gold wedge, ball and ribbon bonders, dry nitrogen backfill, and hermetic sealing of the package using laser welding where required. RF testing is carried out to the customer requirements. Spectrum, Vector, Scalar, Power, Noise Figure, Phase Noise and Modulation measurements up to 50GHz are available. Die probe, bond pull testing, and full environmental testing are performed as required.